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Special Report: Inside Intel, CEO Pat Gelsinger fumbled the revival of an American icon [Reuters] (archive.fo)

submitted 3 weeks ago* (last edited 3 weeks ago) by Rekall_Incorporated@lemm.ee to c/technology@lemmy.world

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[–] GamingChairModel@lemmy.world 2 points 3 weeks ago (1 children)

Intel got caught off guard by the rise of advanced packaging, where AMD's chiplet design could actually compete with a single die (while having the advantage of being more resilient against defects, and thus higher yield).

Intel fell behind on manufacturing when finFETs became the standard. TSMC leapfrogged Intel (and Samsung fell behind) based on TSMC's undisputed advantage at manufacturing finFETs.

Those are the two main areas where Intel gave up its lead, both on the design side and the manufacturing side. At least that's my read of the situation.

[–] Buffalox@lemmy.world 2 points 3 weeks ago

Intel got caught off guard by the rise of advanced packaging,

For servers and workstation yes, but the first 2 Ryzen generations were still 1 chip packages for desktop. And Intel lost marketshare quicker to AMD on desktop than on servers.
So while packaging was an important factor in higher end, Intel actually lost marketshare a lot slower on servers, where the packaging was the biggest benefit for AMD.
On desktop I think Intel lost because they'd stayed on 4 cores for too long. I remember personally complaining that my freaking phone had more cores than my desktop.
So I jumped to AMD as soon as I could afford the upgrade. 😀

On workstations AMD absolutely trounced Intel with Threadripper. Threadripper was amazing, a giant improvement of workstations, it's sad that they don't prioritize that segment anymore.