this post was submitted on 24 Sep 2025
41 points (95.6% liked)

Technology

75634 readers
3089 users here now

This is a most excellent place for technology news and articles.

Our Rules

  1. Follow the lemmy.world rules.
  2. Only tech related news or articles.
  3. Be excellent to each other!
  4. Mod approved content bots can post up to 10 articles per day.
  5. Threads asking for personal tech support may be deleted.
  6. Politics threads may be removed.
  7. No memes allowed as posts, OK to post as comments.
  8. Only approved bots from the list below, this includes using AI responses and summaries. To ask if your bot can be added please contact a mod.
  9. Check for duplicates before posting, duplicates may be removed
  10. Accounts 7 days and younger will have their posts automatically removed.

Approved Bots

founded 2 years ago
MODERATORS
L3s@lemmy.world
enu@lemmy.world
technopagan@lemmy.world
L4s@lemmy.world
L3s@hackingne.ws
L4s@hackingne.ws
41
AI chips are getting hotter. A microfluidics breakthrough goes straight to the silicon to cool up to three times better. (news.microsoft.com)
submitted 6 days ago by inclementimmigrant@lemmy.world to c/technology@lemmy.world
8 comments fedilink hide all child comments
you are viewing a single comment's thread
view the rest of the comments
[–] db2@lemmy.world 17 points 6 days ago (2 children)

idgaf about the ai hype bullshit, does this have applications for real processors?

[–] brendansimms@lemmy.world 13 points 6 days ago

microfluidic cooling has also been a hot topic in power electronics for some years now. Higher power density materials (GaN, SiC..) allow for miniaturization of the devices, but then the bigass heatsinks offset the improvement, so microfluidics are developing quickly. Good read (may not have access, but just ask sci hub...): https://www.nature.com/articles/s41586-020-2666-1