this post was submitted on 18 Jun 2026
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46
AMD ‘had to re-engineer’ the Ryzen 7 5800X3D for a re-release — 10th Anniversary Edition chip had ‘a whole body of engineering work’ put into it (www.tomshardware.com)
submitted 6 hours ago by Sandbar_Trekker@lemmy.today to c/technology@lemmy.world
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AMD’s David McAfee, VP and general manager of Radeon and Ryzen, says that “a whole body of engineering work” went into the re-release, as the original bonding process TSMC used for the Ryzen 7 5800X3D was no longer available.

[...]

“It completely changed the characteristics of how those two pieces of silicon are bonded together and how they were stacked together, and so when that first-gen facility really kind of went offline, then it meant there was a whole, you know, body of engineering work that had to be done to understand if we could even migrate the 5800X3D to the new, second-generation stacking process,” McAfee said.

Well, a facility that can handle that process going offline explains why the processor stopped being produced even though it's been in high demand for a while.

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[–] notthebees@reddthat.com 11 points 5 hours ago (1 children)

It's 10th anniversary for ryzen, not that chip specifically. Also its it's quite good and outperforms most of their non x3d lineup

[–] panda_abyss@lemmy.ca 4 points 5 hours ago

Ohhhh

I feel stupid, thank you!